WLCSP
在有限空间内实现无限创意
尊龙凯时创新SPI Nor Flash和SPI NAND Flash可以提供WLCSP封装（Wafer Level Chip Scale Packaging）。不同于传统塑封封装，WLCSP是一种晶圆级芯片封装方式，可以提供和晶片尺寸相同的封装大小，我们的WLCSP尺寸最小能做到长宽均不到1mm，最薄0.25mm，具有无可比拟的尺寸优势，同时，WLCSP封装还能增加芯片的散热性，提升数据传输稳定性。
从小尺寸、到低功耗，尊龙凯时创新采用WLCSP封装突破了存储器件的物理极限，现在，WLCSP封装已经广泛应用在穿戴类应用当中。随着小型化市场需求的发展，WLCSP将成为未来重要的封装形式之一。
关键信息
SPI Nor Flash和SPI NAND Flash可提供4Mbit~2Gb WLCSP封装
可接受产品定制，符合用户独特的产品需求
显示38种器件
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| 型号 | 状态 | 电压 | 容量 | 频率(MHz) | 主要特性 | 主要封装 | 温度 |
|---|---|---|---|---|---|---|---|
| GD25LX512ME | MP | 1.8V | 512Mb |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LX256E | MP | 1.8V | 256Mb |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
SOP16 300mil, TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LX128J | MP | 1.8V | 128Mb |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25NX128J | UD | 1.8V VCC, 1.2V VIO | 128Mb |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LX64J | UD | 1.8V | 64Mb |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25NX64J | UD | 1.8V VCC, 1.2V VIO | 64Mb |
200(x1 x8), 200(x8 DTR) |
ECC,DTR, H/W RESET,WP#, Secured OTP |
TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LB512ME | NR | 1.8V | 512Mb |
166(x1 x4), 90(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP16 300mil, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array), WLCSP (3-2-3 ball array), |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LB256E | NR | 1.8V | 256Mb |
166(x1 x4), 104(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
WSON8 6x5mm, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array), WLCSP (4-4 ball array), WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LQ255E | MP | 1.8V | 256Mb | 133(x1 x2 x4) |
H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP16 300mil, WSON8 6x5mm, WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array), WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LF255E | MP | 1.8V | 256Mb |
166(x1 x2 x4), 104(x4 DTR) |
DTR,Default 4I/O, H/W RESET, Secured OTP, Suspend |
WSON8 6x5mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE255E | MP | 1.8V | 256Mb | 133(x1 x2 x4) |
H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
WSON8 6x5mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE256H | MP | 1.8V | 256Mb |
166(x1 x2 x4) 104(x4 DTR) |
DTR,H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
WSON8 6x5mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LQ128E | MP | 1.8V | 128Mb | 133(x1 x2 x4) |
H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 4x4mm, WSON8 6x5mm, WSON8 8x6mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE128E | MP | 1.8V | 128Mb | 133(x1 x2 x4) |
H/W RESET,WP#, Secured OTP, Suspend, Unique ID |
FO-USON8 3x3mm, USON8 4x4mm, WSON8 6x5mm, VSOP8 208mil, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE128D | NR | 1.8V | 128Mb | 120(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, VSOP8 208mil, WSON8 6x5mm, WSON8 8x6mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LB128D | NR | 1.8V | 128Mb | 120(x1 x2 x4) |
Default 4I/O, S/W RESET, Secured OTP, Suspend, Unique ID |
SOP8 208mil, VSOP8 208mil, WSON8 6x5mm, WLCSP (4-4 ball array), |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25UF128E | MP | 1.2V | 128Mb |
120(x1 x2 x4), 80(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 208mil, USON8 4x4mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array), WLCSP (4-4 ball array) |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
| GD25LQ64E | MP | 1.8V | 64Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WSON8 6x5mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE64E | MP | 1.8V | 64Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WLCSP (4-4 ball array), WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25UF64E | MP | 1.2V | 64Mb |
120(x1 x2 x4), 80(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 208mil, USON8 3x4mm, WLCSP (4-4 ball array) |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
| GD25WQ64E | MP | 1.65V~3.6V | 64Mb | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WSON8 6x5mm, WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LQ32E | MP | 1.8V | 32Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (4-4 ball array), WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LQ32D | NR | 1.8V | 32Mb | 120(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE32E | MP | 1.8V | 32Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
USON8 3x2mm, USON8 3x4mm, USON8 4x4mm, WLCSP (4-4 ball array), WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE32D | NR | 1.8V | 32Mb | 120(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
USON8 3x4mm, USON8 4x4mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LB32D | NR | 1.8V | 32Mb | 120(x1 x2 x4) |
Default 4I/O, S/W RESET, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x4mm, USON8 4x4mm, WSON8 6x5mm, |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25UF32E | UD | 1.2V | 32Mb |
104(x1 x2 x4), 60(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (3-2-3 ball array) |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
| GD25LQ16E | MP | 1.8V | 16Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LQ16C | NR | 1.8V | 16Mb | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x4mm |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE16E | MP | 1.8V | 16Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 208mil, USON8 3x2mm, WLCSP (3-2-3 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE16C | NR | 1.8V | 16Mb | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID | SOP8 208mil |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25UF16E | S | 1.2V | 16Mb |
104(x1 x2 x4), 60(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (3-2-3 ball array) |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
| GD25LQ80C | NR | 1.8V | 8Mb | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, WSON8 6x5mm, |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE80E | MP | 1.8V | 8Mb | 133(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, USON8 3x2mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25LE80C | NR | 1.8V | 8Mb | 104(x1 x2 x4) |
S/W RESET,WP#, Secured OTP, Suspend, Unique ID |
SOP8 150mil, USON8 3x2mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25UF80E | UD | 1.2V | 8Mb |
104(x1 x2 x4), 60(x4 DTR) |
DTR,Default 4I/O, H/W RESET,WP#, Secured OTP |
SOP8 150mil, SOP8 208mil, USON8 3x2mm, USON8 3x4mm, WLCSP (4-4 ball array) |
-40℃~85℃ -40℃~105℃ -40℃~125℃ |
| GD25WD40C | NR | 1.65V~3.6V | 4Mb |
100(x1), 80(x2) | WP#,Unique ID |
SOP8 150mil, USON8 1.5x1.5mm, USON8 3x2mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
| GD25WD20C | NR | 1.65V~3.6V | 2Mb |
100(x1), 80(x2) | WP#,Unique ID |
SOP8 150mil, USON8 1.5x1.5mm, USON8 3x2mm, WLCSP (4-4 ball array) |
-40℃~85℃, -40℃~105℃, -40℃~125℃ |
